Extreme Efficiency
Dielectric fluid boils directly on chip surfaces, harvesting latent heat at the source. No thermal paste, no heatsink, no duct.
Two-Phase Immersion Cooling
Entropy Cooling engineers fluid-based thermal management systems that eliminate fans, reduce energy consumption by up to 40%, and unlock compute densities that air cooling can never reach.
A fundamental rethink of how heat leaves a chip.
Dielectric fluid boils directly on chip surfaces, harvesting latent heat at the source. No thermal paste, no heatsink, no duct.
Pack 100kW+ per rack in a standard footprint. Entropy systems support next-generation AI accelerators and HPC workloads at full TDP.
Zero fans. Zero compressors in the fluid loop. Your data center floor becomes a quiet, efficient machine room.
From AI inference clusters to edge compute — Entropy Cooling scales to your challenge.
Talk to our engineering team about your thermal requirements.
Start a Conversation